We now offer a SMARC starter kit for the new Intel Atom® x6000E series (codename Elkhart Lake). As a practical help for the start of development, our starter kit contains all necessary components for an immediate start with the new x86 processors. It consists of a SMARC carrier board (eDM-CB-SM-IPCS), a passive cooling solution and various connection cables for quick and easy evaluation of the module. Our in-house designed SMARC 2.1 module is based on the latest Intel Atom® x6000E, Pentium® and Celeron® N & J processor generation. Thanks to the improved graphics performance of the processor, up to three independent displays with a resolution of up to 4K are supported. The SMARC 2.1 module is suitable for IoT applications, as well as edge computing, gateways and robotics.

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In February, we received the "Product of the Year" award for capacitive gesture control in the category Industrial + IOT by the well-known German trade magazine Elektronik (German only). Innovative products and technologies were presented in a total of eight different categories, from which the readership could choose their favorites.

As a human machine interface, contactless operation using gesture control offers numerous advantages. Based on Microchip's GestIC® technology, we have internally developed a controller board that combines 2D PCAP functionality with 3D gesture control. In addition to the usual input by touch, the GUI can be operated using defined gestures without touching the system.

"We are very pleased that our innovative capacitive gesture control has been honored with the Product of the Year award. The award is a confirmation of our innovative strength and at the same time underlines our mission to support our customers' business operations with groundbreaking technology developments," explains Markus Hell, Head of Product Management for Touch Solutions at DATA MODUL.

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We have three new server-on-module families from our partner Congatec in our portfolio. The x86-based COM-HPC server modules in sizes E and D as well as the COM Express Type 7 modules are based on the latest Intel Xeon D processors (codename: Ice Lake D) and, thanks to their extended temperature range of -40 °C to +85 °C, are particularly well suited for a wide range of industrial, outdoor and IoT applications, but also for use in edge computing and transportation.

The new x86 COM-HPC server-on-modules have up to 20 available cores and enable an enormously high memory bandwidth with up to 8 RAM sockets, which is essential for server workloads. In addition, the server modules have TCC/TSN-based real-time Ethernet.

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With the eDM-CB-COMeT6-REF we extend our embedded portfolio by a new carrierboard, which appears in mini-ITX format and as a modular platform is the ideal starting point for customer specific designs. As a COM Express^® Type 6 carrierboard, it is able to accommodate modules in the basic and compact form factor.

Matching the carrierboard, we offer the eDM-COMB-CR6, an extremely scalable Intel COM Express^® module with Intel^® Core^™, Xeon^®, Celeron^® and Pentium^® processors of the ninth generation. The module is suitable for use in embedded edge computing such as IoT gateways, high-end HMIs and digital signage systems.

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New to our portfolio is the EMS-TGL from Avalue. This fanless Tiger Lake UP3 box-PC is equipped with 11th generation Intel® Core™ i3/i5/i7 processors and 2 x 260-pin SODIMM sockets (with up to 64GB DDR4).

The EMS-TGL supports 5G module and offers a wide range of interfaces, which makes it ideally suitable for various IoT applications. The internal Intel® Iris® Xe graphics unit enables a near tripling of graphics performance. In addition, the new EMS-TGL features PCI Express 4.0 and Thunderbolt™ 4/USB4.

The rugged design ensures smooth operation even in demanding applications such as extreme weather conditions or strong vibrations.

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