From the selection of suitable peripherals to supplier management and final system integration

From the selection of suitable peripherals to supplier management and final system integration

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Timline Text

The introduction of this new process ideally complements DATA MODUL's range of in-house bonding processes. Display and touch unit are bonded by means of a gel pad. This process is particularly suited for bonding displays with thin or no frames.

Timeline Media
Introduction of the gel bonding process
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DATA MODUL Inc. - Headquarters
Location address

275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States

Phone: +1 (631) 951-0800

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