From the selection of suitable peripherals to supplier management and final system integration

From the selection of suitable peripherals to supplier management and final system integration

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In 2019, DATA MODUL expanded its in-house bonding portfolio with a new technology: the hybrid bonding process. Hybrid Bonding combines the advantages of the LOCA and OCA processes and is suitable for bonding touch sensors to glass as well as for bonding glass or touch sensors directly to displays.

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Hybrid bonding at DATA MODUL
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DATA MODUL Inc. - Headquarters
Location address

275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States

Phone: +1 (631) 951-0800

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