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Cpu-Boards(1)

Compare	conga-TEVAL/COMe 3.0
Manufacturer	Congatec
Product type	Carrierboard
Formfactor	Proprietary
Architecture	x86
CPU	n.a.
Chipset io hub	n.a.
Memory (on board)	n.a.
Flash	n.a.
Operating temp. (low to high)	0 °C to 60 °C
eDP	up to 1
LVDS	up to 1
DP	up to 3
Ethernet	up to 1
USB 2.0	up to 2
USB 3.0/3.1	up to 4
CAN	up to 1
RS232	up to 1
RS422	up to 1
RS485	up to 1
Outline dimensions horizontal	294.00 mm
Outline dimensions vertical	244.00 mm
	Request info/quote Request info/quote For this product you can select following accessories and services: Accessories Cooling solutions Cables Memory (on board) HDD/SSD Expansion modules Carrier boards and baseboards Services Operating system support Embedded computing design Leave this field blank

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