From the selection of suitable peripherals to supplier management and final system integration

From the selection of suitable peripherals to supplier management and final system integration

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conga-TEVAL/COMe 3.0

ID
12041090
Manufacturer
Congatec
Product type
Carrierboard
Formfactor
Proprietary
Architecture
x86
CPU
n.a.
Chipset io hub
n.a.
Memory (on board)
n.a.
Flash
n.a.
Operating temp. (low to high)
0 °C to 60 °C
eDP
up to 1
LVDS
up to 1
DP
up to 3
Ethernet
up to 1
USB 2.0
up to 2
USB 3.0/3.1
up to 4
CAN
up to 1
RS232
up to 1
RS422
up to 1
RS485
up to 1
Outline dimensions (H→ x V↑)
294.0 x 244.0 mm
Conga-TEVAL (1.1 MB) User's Guide for conga-TEVAL-COMe 3.0 (4.31 MB)
Accessories
  • Cooling solutions
  • Cables
  • Memory (on board)
  • HDD/SSD
  • Expansion modules
  • Carrier boards and baseboards
Services
  • Operating system support
  • Embedded computing design
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CPU Boards conga-TEVAL/COMe 3.0
Contact
DATA MODUL Inc. - Headquarters
Location address

275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States

Phone: +1 (631) 951-0800
 
RMA

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