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From the selection of suitable peripherals to supplier management and final system integration
| Compare | conga-TEVAL/COMe 3.0 |
| Manufacturer |
Congatec
|
| Product type |
Carrierboard
|
| Formfactor |
Proprietary
|
| Architecture |
x86
|
| CPU |
n.a.
|
| Chipset io hub |
n.a.
|
| Memory (on board) |
n.a.
|
| Flash |
n.a.
|
| Operating temp. (low to high) | |
| eDP |
up to 1
|
| LVDS |
up to 1
|
| DP |
up to 3
|
| Ethernet |
up to 1
|
| USB 2.0 |
up to 2
|
| USB 3.0/3.1 |
up to 4
|
| CAN |
up to 1
|
| RS232 |
up to 1
|
| RS422 |
up to 1
|
| RS485 |
up to 1
|
| Outline dimensions horizontal |
294.00 mm
|
| Outline dimensions vertical |
244.00 mm
|
