From the selection of suitable peripherals to supplier management and final system integration

From the selection of suitable peripherals to supplier management and final system integration

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SolderCoreMX8ULP

ID
12065277
Manufacturer
F&S
Product type
COM
Formfactor
Proprietary
Architecture
ARM
CPU
i.MX 8ULP
Chipset io hub
integrated
Memory (on board)
2 GByte LPDDR4
Flash
64 GB eMMC
Operating temp. (low to high)
-40 °C to 85 °C
MIPI/CSI
up to 1
MIPI/DSI
up to 1
Ethernet
up to 1
USB 2.0
up to 2
CAN
up to 1
UART
up to 8
Outline dimensions (H→ x V↑)
35.0 x 35.0 mm
SolderCore8ULP-A4-Englisch (479.1 KB) SolderCore8ULP Hardware eng (447.97 KB)
Accessories
  • Cooling solutions
  • Cables
  • Memory (on board)
  • HDD/SSD
  • Expansion modules
  • Carrier boards and baseboards
Services
  • Operating system support
  • Embedded computing design
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CPU Boards SolderCoreMX8ULP
Contact
DATA MODUL Inc. - Headquarters
Location address

275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States

Phone: +1 (631) 951-0800
 
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