From the selection of suitable peripherals to supplier management and final system integration

From the selection of suitable peripherals to supplier management and final system integration

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In 2019, the range of bonding processes was expanded by the hybrid bonding process. Hybrid bonding combines the advantages of the LOCA and OCA and is suited for bonding touch sensors to glass as well as for bonding glass or touch sensors to displays. A perfect bonding method especially for touch glass display solutions with high volume requirements.

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Introduction of the hybrid bonding process
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DATA MODUL Inc. - Headquarters
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275 Marcus Blvd
Unit R
Hauppauge, NY 11788
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