News line content

From the selection of suitable peripherals to supplier management and final system integration

Innovator of the Year with hybrid bonding

Company
Innovator of the Year with hybrid bonding

In November 2020, we received the “Innovator of the Year” award for hybrid bonding in the category Optoelectronics / Display by the well-known German trade magazine Design & Elektronik. Innovative products and technologies were presented in a total of 13 different categories, from which the readership could choose their favorites.

As one of the first companies in Europe, we offer the fully automated hybrid bonding process at our production site in Weikersheim / Germany. Hybrid bonding is a further developed combination of the two classic bonding methods LOCA (liquid) and OCA (dry lamination) and represents a particularly economical method for high-volume touch projects.

More info about our bonding methods

RSS feed
DATA MODUL Inc. - Headquarters
Location address

275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States

Phone: +1 (631) 951-0800

Contact

For any questions, please feel free to contact us.
Please fill in the form and hit submit. If desired, we will get in touch with you within the next few days. Your contact data will be kept confidential.

You agree that we may store and process your data to answer your request. You can revoke your consent at any time by e-mail to datenschutz(at)data-modul.com or to the contact details given in the imprint. Incidentally, we refer to our privacy policy.