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Discover our Customised Embedded Set Solutions (CESS) for seamless integration into your systems
News line content
Discover our Customised Embedded Set Solutions (CESS) for seamless integration into your systems
Full bonding solutions for E-Paper displays
Hardware
Services
With a thickness of only 1 mm, E-Paper displays are extremely thin and therefore often fragile. The integration into an overall system can be challenging - especially with increasing diagonal size.
By bonding an e-Paper display with a suitable cover glass, we succeed in transforming the sensitive modules into a robust unit that will significantly simplify further processing or embedding the product into a system in the future. Cover glasses provide additional protection for the application and visually enhance the end product thanks to a wide range of individual design options, such as printing a logo.
Our full-bonding solutions are suitable, for example, for applications in the hospitality sector, such as menus, but can also be used for patient monitoring. Especially for diagonals smaller than 7", we can offer cost-optimised full bonding solutions with our new bonding process for small sizes and also support customers in the control and integration of their product. Optionally, we can also equip our e-Paper displays with a bonded PCAP touch sensor to enable touch functions.
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DATA MODUL Inc. - Headquarters
Location address
275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States
Phone: +1 (631) 951-0800
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